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Cutting-Edge 3D Stereo-Vision Camera Unveiling at CES 2023

The humans behind H-u-m-a-n-o-i-d.com May 18, 2026 2 min read
Cutting-Edge 3D Stereo-Vision Camera Unveiling at CES 2023

STMicroelectronics and eYs3D Microelectronics are set to display their joint efforts on a cutting-edge 3D stereo-vision camera for machine vision and robotics at CES 2023. The collaboration between STMicroelectronics, a global semiconductor leader, and eYs3D Microelectronics, a provider of end-to-end hardware and software systems for computer vision, aims to showcase advancements in machine vision technology at the upcoming CES event, scheduled for January 5-8 in Las Vegas.

The partnership leverages STMicroelectronics’ advanced image sensors, known for their high sensitivity, low crosstalk, and class-leading pixel size due to proprietary process technologies. This collaboration enables the creation of compact systems offering outstanding machine-vision performance at a competitive price point. eYs3D Microelectronics’ expertise in capture, perception understanding, and 3D-fusion complements ST’s capabilities, opening up new opportunities in the machine vision market for applications such as robots, home automation, and home appliances.

The joint demonstration at CES will feature two reference designs, the Ref-B6 and Ref-B3 ASV (Active Stereo Vision) video and depth cameras. These designs combine eYs3D’s CV processor and eSP876 stereo 3D Depth-Map chipset with ST’s global shutter image sensors, enhancing near-infrared sensitivity and improving object edge detection and depth de-noising. The cameras can output high-quality 3D depth data at up to 60 fps, optimized for depth sensing and point-cloud creation.

The Ref-B6 stereo-video camera, with a 6-centimeter baseline and wide field of view, demonstrates the advanced hardware design achieved through the collaboration. Both reference designs come with a Software Development Kit (SDK) supporting various operating systems and programming languages, enhancing ease of integration and development for customers.

STMicroelectronics and eYs3D Microelectronics invite attendees to experience their innovative solutions at CES 2023. The joint development Ref-B6 Depth Camera will be showcased at two booth locations: LVCC, Booth #15769, Central Hall, and Venetian, Eureka Park, Booth #62500, AT1, Hall G. For further inquiries or to arrange appointments for customer presentations, please contact local sales representatives or email sales@eys3d.com.

In summary, the collaboration between STMicroelectronics and eYs3D Microelectronics represents a significant advancement in machine vision technology, offering enhanced capabilities for various industries and applications. The joint efforts aim to drive innovation, efficiency, and performance in the field of computer vision, providing customers with cutting-edge solutions tailored to their needs.

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